Blade server system with a management bus and method for managing the same

ABSTRACT

A blade server system with a management bus and method for managing the same. The blade server system includes a connection board and a management module. The connection board is used for modular interconnection, including communication paths for conducting signals including a management bus signal group and a first bus signal group. The management module is used for management of the blade server system using signals including the management bus signal group and the first bus signal group. If a module is detected, the management module selects the detected module through the management bus and acquires module configuration information of the detected module through the first bus signal group. Distribution of power from a power source to the blade server system is determined according to system configuration information including the module configuration information of the module so that the power source is prevented from being overloaded.

This application claims the benefit of Taiwan application Serial No.93220979, filed Dec. 27, 2004, the subject matter of which isincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates in general to a server system and a managementmethod, and more particularly to a blade server system with a managementbus and method for management thereof.

2. Description of the Related Art

A blade server system is a high-density system capable of containing anumber of server blades each of which is electrically connected to acommon middle plane, or midplane, of the blade server system throughcorresponding connectors of the server blades specifically designed withhigh-density pin or socket contact assignment. These contacts of theconnectors conduct power signals, high-speed data signals, low-speeddata signals, and universal serial bus (USB) signals for the support fordifferent features required by the server blade.

The design of a blade server system requires a balance between theimprovement on server performance and the saving of space occupation ofthe server blades on the middle plane, which provides connection betweenthe inserted server blades and shared resources of the blade serversystem. Thus, a need for optimum arrangements for the contacts of theconnectors for specific functions required by the server blade inlimited space is more important than that for providing high-speedsignal transmission.

In addition, the design of a blade server system is a trade-off betweenfeatures and power resource. In order to prevent the power resource frombeing overloaded, the blade server system may need to worsen itsperformance or, if necessary, turn off some modules of the system. Inthe worst case, unexpected system shutdown would occur in case of thepower resource overloaded with the whole system.

The operation of a number of conventional buses in the blade serversystem has a significant impact on the power resource for the bladeserver system. Before the whole system powering on, system configurationinformation has to be collected and the system configuration checked.The system needs to update that information frequently even afterpowered on. After system is powered on, most of the conventional buses,for example, video, COM, inter-integrated circuit (I2C), operate tocollect system configuration information. Some of the buses are requiredoperating under standby power from the power source, thus havingsignificant impact on the standby power resource.

Accordingly, it is desirable to reduce the risk of unpredictableshutdown of the blade server system due to such power impact.

SUMMARY OF THE INVENTION

It is therefore an object of the invention to provide a blade serversystem with a management bus for management of the blade server system,wherein the management bus has priority over other buses including I2C,COM buses, in the blade server system. The blade server system isoperative to employ the management bus to control the other functionalbus, for example I2C bus, to acquire system configuration information ofthe blade server system including module configuration information withrespect to a module associated with the blade server system. Inaddition, distribution of power from a power source to the blade serversystem can be determined according to the system configurationinformation including the module configuration information with respectto the associated module so that the power source is prevented frombeing overloaded with the blade server system.

In accordance to the object of the invention, a blade server system isprovided. The blade server system includes a connection board and amanagement module. The connection board is used for modularinterconnection, including a plurality of communication paths forconducting signals including a management bus signal group and a firstbus signal group. The management module, removably connected to theconnection board, is used for management of the blade server systemusing signals including the management bus signal group and the firstbus signal group. In response to a signal indicating a module connectionto the connection board, the management module determines an addressassociated with the module connection through the management bus signalgroup and acquires module configuration information with respect to theaddress through the first bus signal group. The management moduledetermines distribution of power from a power source to the blade serversystem according to system configuration information including themodule configuration information with respect to the address so that thepower source is prevented from being overloaded with the blade serversystem.

In accordance to the object of the invention, a blade server system isprovided. The blade server system includes a connection board, amanagement module, and a removable module. The connection board is usedfor modular interconnection and includes a plurality of communicationpaths for conducting a plurality of signals including a management bussignal group and a first bus signal group. The management module,removably connected to the connection board, is employed for managementof the blade server system using signals including the management bussignal group and the first bus signal group. The removable module,removably connected to the connection board, includes a management businterface circuit. The management bus interface circuit, in response tothe management bus signal group, is used for selectively controllingapplication of power from a power source to the removable module andactivation of function of the first bus signal group on the removablemodule.

In accordance to the object of the invention, a method is provided formanaging a system including a connection board for modular communicationusing a plurality of signal groups including a first signal group and asecond signal group. The method includes the following steps. First, amanagement module is provided associated with the connection board formanagement of the system using at least the first signal group and thesecond signal group. A detection is then made as to whether there is anyremovable module connected to the connection board. If a removablemodule is detected to be connected to the connection board, an addressassociated with the removable module is determined through the firstsignal group. Function of the second signal group with respect to thedetermined address on the removable module is activated through thefirst signal group. Module configuration information with respect to thedetermined address is acquired through the second signal group. Next,the management module determines distribution of power from a powersource to the system according to system configuration informationincluding the module configuration information with respect to thedetermined address.

Other objects, features, and advantages of the invention will becomeapparent from the following detailed description of the preferred butnon-limiting embodiments. The following description is made withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates the basic structure of a blade server system with amanagement bus according to an embodiment of the invention.

FIG. 2 illustrates the structure of a module link according to anembodiment of the invention.

FIGS. 3A and 3B show a management method of a modular system accordingto an embodiment of the invention.

FIG. 4 shows a connection board with connectors for the connection ofremovable modules to the connection board, according to an embodiment ofthe invention.

FIG. 5 shows a processing blade module equipped with two connectors forconnection to the connection board shown in FIG. 3, according to anembodiment of the invention.

FIG. 6 is a partial, cross-sectional view illustrating connectionbetween a server blade and a midplane of a blade server system through asecond connector of the server blade and a first connector of themidplane, according to an embodiment of the invention.

FIG. 7A is a pin assignment of the second connector in FIG. 6 compliantwith a first connector specification.

FIG. 7B is a pin assignment of the second connector in FIG. 6 compliantwith a second connector specification.

FIG. 7C is a pin assignment of the second connector in FIG. 6 compliantwith a third connector specification.

FIG. 7D is a pin assignment of the second connector in FIG. 6 compliantwith a fourth connector specification.

FIG. 7E is a pin assignment of the second connector in FIG. 6 compliantwith a fifth connector specification.

FIG. 7F is another pin assignment of the second connector in FIG. 6compliant with the fifth connector specification.

DETAILED DESCRIPTION OF THE INVENTION

Basic System Structure

Referring to FIG. 1, the basic structure of a blade server system with amanagement bus is shown according to an embodiment of the invention.According to the invention, the blade server system 10 provides amanagement bus 20 for management of the blade server system 10, whichhas priority over other functional buses 30 such as inter-integratedcircuit (I2C) bus in the blade server system 10. The blade server system10 is enabled to control a number of removable modules, such asprocessing blade modules, network modules, and KVM module, that connectto the management bus 20. In one embodiment, a management module of theblade server system 10 serves as a management unit for collectinginformation of the configuration of the system through the managementbus 20 and at least a functional bus. The system configurationinformation that the management module acquires includes configurationinformation of, for example, a number of linked modules or a removablemodule that has just plugged into the system. The management module candetermine distribution, according to the collected configurationinformation of the system, of power from a power resource to the bladeserver system, including the modules linked to the system.

The power source is prevented from being overloaded with the bladeserver system under the power distribution determined by the managementmodule according to the collected system configuration information. Forexample, when it is determined that the power source would not beoverloaded under the status of the current system configuration, themanagement module enables functional buses and provides main power for aremovable module which has plugged into the system by the power sourceand turn on the removable module. Conversely, when the power sourcewould be overloaded or unstable under the status of the current systemconfiguration, the management module can decide not to enable main powerfor that removable module and not to turn on this module immediately.

In this way, a significant impact on the power resource, such as impactstandby power resource due to module addition, can be detected and therisk of unpredictable shutdown of the system due to such impact can beavoided by the distribution of power determined by the management moduleaccording to the system configuration information collected.

In one embodiment, the blade server system 10 has a chassis (not shown)housing all the components of the blade server system 10 and having acapacity for a number of removable modules to connect to the system toshare common infrastructure resource, for example power resource,cooling devices, KVM (short for keyboard, video, and mouse), opticaldisk access, and network connection. The blade server system 10, asshown in FIG. 1, provides in the chassis different numbers or types ofslots or bays for module insertion and removal, for example, 10 bladebays for up to ten processing blade modules (CPU blade modules 1 to 10),six network module bays for up to six switch modules (network modules 1to 6), two Small Computer System Interface (SCSI) bridge module bays forup to two bridge modules (SCSI bridge modules 1 and 2), two managementmodule bays for up to two management modules (MMB1 and MMB2), four powersupply module bays for up to four power supply modules (PSU1 to PSU4),two cooling module bays for up to two cooling modules (fan modules 1 and2), a virtual-keyboard-video-mouse (KVM) module bay for a KVM module,and a front control module.

A removable module can be inserted into one of the bays or slots of thechassis and linked to other modules through a connection board 10 formodular interconnection. A processing blade module having one or moremicroprocessors, main memory, cooperating chipsets, hard drives, andnetwork interfaces for information processing, configured in ahot-pluggable manner, and serving as an independent web server, databaseserver, email or communication server, is an example of a removablemodule. Another example of a removable module is a network module, suchas a network switch for gigabit Ethernet or 10 gigabit Infiniband bus.The connection board 100 can be a midplane or backplane, and can beimplemented with a printed circuit board having a plurality ofconnectors for a plurality of various removable modules to plug into formodular interconnection. In addition to electrical connection, theconnection board 100 can be implemented with a board providing opticalconnection, channels, and/or media, in part or fully, for modularinterconnection and thus a removable module may link to the connectionboard 100 in an optical connection manner without using connectorshaving contacts or pins.

Module Interconnection Structure

FIG. 2 illustrates a structure of module interconnection in the bladeserver system as shown in FIG. 1 according to an embodiment of theinvention. As shown in FIG. 2, the management module 110 and theprocessing blade module 120 are connected to the blade server system 10through at least the management bus 20 and a functional bus, I2C bus 30for example. As the embodiment illustrated in FIG. 1, both themanagement module 110 and the processing blade module 120 are removablyconnected to a connection board 100 for modular interconnection. Theconnection board 100 includes a number of communication paths forconducting signals including a signal group for the management bus and asignal group for the functional bus, such as an I2C bus 30.

The management module 110 is used for management of the blade serversystem 10 using signals including the management bus signal group andthe I2C bus signal group. In the system, the management bus signal grouphas priority over other signal groups and is employed to enable thefunction of other signal groups selectively on the other modules. Forexample, the management module 10 enables the function of the I2C bussignal group on a connected module through the management bus signalgroup. Besides, in response to a signal indicating a module connectionto the connection board received through a signal path provided by theconnection board 100, for example, connectors, contacts, a wire, anoptical connection, or a sensor, the management module 110 determines anaddress associated with the module connection through the management bussignal group and acquires module configuration information with respectto the address through the bus signal group, e.g. I2C bus signal group.

In FIG. 2, a removable module, such as the processing blade module 120,further includes a management bus interface circuit 200 which, inresponse to the management bus signal group, is used for selectivelycontrolling application of power from a power source to the removablemodule 120 and selectively controlling activation of function of asignal group of a bus or signal groups of a number of buses, such as I2Cbus, UART bus, or KVM bus, on the removable module 120. In response tothe management bus signal group indicating activation of function of thefirst bus signal group on the removable module 120, the management businterface circuit 200 activates function of a first bus signal group,for example, on the removable module 120. In response to the managementbus signal group indicating powering on the addressed module, themanagement bus interface circuit 200 enables application of power fromthe power source to the removable module so as to power on the removablemodule 120. If the management module 110 determines to power on theremovable module 120 using power, such as main power, from the powersource, the management module 120 generates the management bus signalgroup indicating powering on the removable module to the removablemodule. In response to the management bus signal group indicatingpowering on the removable module to the removable module, the managementbus interface circuit 200 enables application of the power, such as mainpower, from the power source to the removable module 120 so as to poweron the removable module 120. As an example, a control circuit 210 withswitching elements in response to control signals from the managementbus interface circuit 200 can implement on the removable module forenabling or activation of function related to power, such as poweringon, powering off, or resetting, as well as the enabling or activation offunction of one or more functional buses, for example, I2C, UART, andKVM buses. In another example, the control circuit 210 and themanagement bus interface circuit 200 can be implemented as a businterface device with logic circuitry in response to the management bussignal group and one or more other functional bus signal groups orspecific signals on the removable module.

In one embodiment, the signal definition of the management bus includesat least four signals: (1) a function selection signal, designated asF_EN[0:2], a three-bit signal for selectively indicating at most 8predetermined functions with respect to a module; (2) an address signal,S_AD[0:4], for selecting a module; (3) an enabling signal, S_D0, forenabling and disabling function selected; and (4) a strobe signal,STROBE, for latching signals of the management bus. In terms of theabove definition of the function selection signal, three kinds ofcommands for module power control, module reset, and module busselection are defined. For different functional buses, bus selectioncommands may include I2C bus function activation, UART bus functionactivation, and KVM bus function activation. These commands will beexplained in the following management method according to an embodimentof the invention.

Management Method

Referring to FIGS. 3A and 3B, a management method of a modular system,such as the blade server system 10 illustrated in FIG. 1, is shownaccording to an embodiment of the invention in flowchart form. Themodular system, in general, includes a connection board for modularcommunication using a plurality of signal groups including a firstsignal group and a second signal group, such as the connection board 100in FIG. 1, wherein the first signal group has priority over other signalgroups. Accordingly, the first signal group is employed for managementof the modular system.

In FIG. 3A, the method includes providing a management module associatedwith the connection board for management of the system using at leastthe first signal group and the second signal group, as indicated in step310. In step 320, the management module begins to detect status of themodular system, the system status including status of modules connectedto the connection board. Step 330 is then performed to determine whetherthere is any removable module connected to the connection board, forexample, a module connected to the connection board before themanagement module is provided or a module being inserted into theconnection board after the management module is provided. If a removablemodule is detected to be connected to the connection board, theremovable module is selected through the first signal group, as shown instep 340. Next, in step 350, module configuration information withrespect to the detected module is acquired through the second signalgroup. The management module then in step 360 detects whetherconfiguration information of all connected modules is acquired. If not,the method repeats from steps 330 to 360 until configuration informationof all connected modules is acquired. If the configuration informationof all connected modules is acquired, the management module determinesdistribution of power from a power source to the system according tosystem configuration information including the acquired moduleconfiguration information, as indicated in step 370. In step 380, themanagement module performs management functions through the first signalgroup according to the determination of power distribution. After that,the method proceeds from step 320 to detect system status routinely sothat the management module can be responsive to changes in configurationof the modular system.

In one example of the management method, the power source is an AC powersource, the first signal group is the management bus signal group withthe above signal definition and the second signal group is an I2C bussignal group. When the AC power source is applied to the modular system,the management module is activated by lower power, such as a +5V standbysignal, from a power supply powered by the AC power source. In case ofthe presence of a module, the management enables the provision of lowerpower, such as +5V standby, from the AC power source on the module. Whena module present signal indicating a module connecting to the connectionboard is detected, the management module selects the detected module,for example, by determining an address associated with the module, forexample, a module identifier in the module, and sending an addresssignal, S_AD[0:4], indicating the module identifier on the managementbus. On receiving the address signal, S_AD[0:4], the modules determinewhether the address signal corresponds to their module identifiers. Ifone module has a module identifier corresponding to the address signal,S_AD[0:4], the module is then selected.

After the detected module is selected, the management module activatesfunction of the I2C signal group on the selected module through themanagement bus signal group by sending a function selection signal,F_EN[0:2], which indicates a bus selection command for selecting the I2Cbus on the selected module and sending an enabling signal, S_DO, whichis asserted or enabled to indicate enabling of the bus selectionindicated by the function selection signal. Enabling the I2C bus signalgroup on the selected module through the management bus signal groupallows the management module to acquire module configuration informationof the selected module via the I2C signal group. In this way, themanagement module acquires module configuration information of themodules present in the modular system one by one. After acquiring thecurrent system configuration information, including module configurationinformation of all modules present, as well as the status of AC powersource, the management module determines distribution of power from theAC power source to the modular system according to the acquired systemconfiguration information.

Distribution of power in the modular system can be determined to meetrequirements of system management, for example, in terms of preventionof a limited power resource from overloading, system stability, and/orperformance. In this example, the power distribution is determined inorder to prevent a limited power resource, such as the AC power sourceor the power supply powered by the AC power source, from beingoverloaded with the modular system. The management module performsmanagement functions through the management bus according to thedetermination of power distribution to prevent power overloaded with themodules, for example, by generating the first signal group, indicatingat least one command, according to the determination of powerdistribution. For example, when it is determined that the power resourcewould not be overloaded under the status of the current systemconfiguration, the management module enables the provision of higherpower, for example main power indicated by +12VDC signals, from thepower resource for the removable modules sequentially by generating thefirst signal group whose function selection signal, F_EN[0:2],indicating a power-on command for module power control to enable mainpower on the modules, so that the modules can then be started up.Conversely, when the power resource would be overloaded or unstableunder the status of the current system configuration, the determinationof power distribution indicates how many and which module is ready to bepowered on. The management module thus enables the provision of mainpower for those modules determined to be powered on by generating thefirst signal group whose function selection signal and address signal isset according to the determination of power distribution.

In one case, a removable module, for example, a processing blade module,has just inserted into the connection board with other modulesoperating. By performing the method as shown in FIGS. 3A-3B, the powerdistribution is then determined as to whether to turn on the insertedprocessing blade module in order to prevent the power resourceoverloaded with the modular system, according to the current systemconfiguration detected after the insertion of that module. For example,when it is determined that the power resource would not be overloadedwith respect to the current system configuration, the management moduleenables the provision of main power for the processing blade module bygenerating the first signal group whose function selection signal,F_EN[0:2], indicating a power-on command for module power control toenable main power on this module, so that the modules can then bestarted up. Conversely, when the power resource would be overloaded orunstable under the status of the current system configuration, themanagement module can decide not to enable the provision of main powerfor that module until the overall power loading is sufficient to dothat.

In addition to the above management functions performed by themanagement module, management functions for KVM bus function, UART(universal asynchronous receiver-transmitter) function, module reset,and power down are presented for example.

As in the blade system 10 in FIG. 1, there is one KVM module to supportall processing blade modules for KVM function. In response to a requestfor use of the KVM module by a specific processing blade module, themanagement module can use a KVM switch command by the first signal groupto switch the connection of the KVM module to the specific processingblade module. In an example of a first processing blade moduleconnecting to the KVM module and a second processing blade modulerequesting for use of it, the management module performs the KVM switchcommand by turning off the KVM bus of the first processing blade moduleand then turning on the KVM bus of the second processing blade module sothat the second processing blade module links to the KVM module.

The blade system 10 in FIG. 1 can further connect to a console throughthe UART bus. In response to a request for redirection of the console toa specific processing blade module, the management module can use a UARTswitch command by the first signal group to switch the connection of theconsole to the specific processing blade module. In an example of afirst processing blade module connecting to the console and a secondprocessing blade module requesting for use of it, the management moduleperforms the UART switch command by turning off the UART port of thefirst processing blade module and then turning on the UART port of thesecond processing blade module so that the second processing blademodule links to the UART module.

When system failure or a reset event occurs, the system needs tore-power on or reset for a specific module. The management module cangenerate a reset command by the first signal group to reset the moduleor send a power off-on command by the first signal group to reboot themodule through the module power control.

Further, the management module can generate a power-off command to eachmodule sequentially by the first signal group to turn off the provisionof power for all the modules.

Connection Board and Module

FIG. 4 shows a connection board with connectors for the connection ofremovable modules to the connection board, according to an embodiment ofthe invention. As shown in FIG. 4, a connection board 400, for example,a printed circuit board, is equipped with a number of connectors. Inthis example, the connection board 400 is a midplane for removablemodules to insert into or remove from, and either front side or rearside of the connection board can be equipped with connectors. Some ofthe connectors are for connection to removable modules and some of theconnectors include contacts or pins for conducting the signal group forthe management bus, wherein the signal paths are not shown for the sakeof brevity. A pair of connectors, such as a lower connector 410 and anupper connector 420, on the printed circuit board 400 are for connectionto a processing blade module, such as the one shown in FIG. 5.

Referring to FIG. 5, a processing blade module is shown equipped withtwo connectors for connection to the connection board shown in FIG. 4.In FIG. 5, a processing blade module 500, for example a server bladewith two processing units (not shown), includes three sets ofconnectors: (1) a lower connector 510 and an upper connector 520,correspondingly, for connection to the connection board 400; (2) anupper connector 530 and a down connector 540 for connector between a FCdaughter board 525 with the main board 505 of the processing blademodule 500; and (3) a first connector 550 and a second connector 560 forPerpheral Component Interconnect (PCI)-based signal bus connection.

Connectors for a Processing Blade Module

Referring to FIG. 6, the connection between a server blade and a middleplane of a blade server system is illustrated, in general, through asecond connector of the server blade and a first connector of the middleplane, respectively is a partial, cross-sectional view according to apreferred embodiment of the invention. In FIG. 6, a blade server system600 includes a middle plane 610 and a server blade 620. The middle plane610 includes a first connector 612 and the server blade 620 includes asecond connector 622. The second connector 622 is used for electricallyconnected to the first connector 612 and has a specific number ofcontacts, for example, pin contacts or pins 624, for insertion intocorresponding pin receptacles 614 of the first connector 612. The secondconnector 622 in FIG. 6 illustrates a typical one of the connectors ofthe 120. Different examples of pin assignment of the second connector622 and functions will be presented below.

FIG. 7A is a pin assignment of the second connector 622 in FIG. 6compliant with a first connector specification. The second connector 622defined in FIG. 7A can be served as the lower connector 510 of theprocessing blade module 500, as shown in FIG. 5. The first connectorspecification complies with a Low_EPT_CONN specification, by Starconncorporation, with characteristics of hard metric 2.0 mm, 8 single rows,2 shielding rows, female, right-angle, DIP, and 99 contacts. Forexample, the second connector 622 compliant with this specification canbe a connector produced by Electronic Precision Technology (EPT) ofmodel number EPT 246-31300-15. The second connector 622 includes 88contacts, such as pins A1˜A11, B1˜B11, C1˜C11, D1˜D11, E1˜E11, F1˜F11,G1˜G11, and H1˜H11. In particular, the connector defined by FIG. 7Aincludes contacts H10 and H11 for conducting I2C bus signals and aspecific contact A1 for outputting a module present signal indicatingthat the module is present when the module is connected to theconnection board. In addition, contacts B3, C2, C3, D3 are forconducting the identifier of the module.

Contacts A1 is pin present for conducting a signal indicating whetherthe server blade is present. Contacts A2 and A3 are pins LVREQBM andLVREQBP for conducting a SCSI (small computer system interface) requestsignal. Contacts A4 to A9, B8, B9, E1, E2, E4, E7, F2 to F11, G2, and G9are pins LVSCDBP11 and LVSCDBM11, LVSCDBM8 and LVSCDBP8, LVSCDBM10 andLVSCDBP10, LVSCDBM9 and LVSCDBP9, LVSCDBM5 and LVSCDBP5, LVSCDBM6,LVSCDBP6, LVSCDBM7 and LVSCDBP7, LVSCDBM0, LVSCDBP0, LVSCDBM1, LVSCDBP1,LVSCDBM2, LVSCDBP2, LVSCDBM3, LVSCDBP3, LVSCDBM4, and LVSCDBP4,LVSCDBM12, LVSCDBP12, LVSCDBM13, LVSCDBP13, LVSCDBM14, LVSCDBP14,LVSCDBM15, and LVSCDBP15 for conducting signals for SCSI channel bytesignal pairs. Contacts B4 and B5 are pins LVIOBM and LVIOBP forconducting SCSI input/output signals. Contacts B6 and B7 are pinsLVSELBM and LVSELBP for conducting selection signals. Contacts C4 and C5are pins LVRSTBM and LVRSTBP for conducting SCSI reset signals. ContactsC6 and C7 are pins LVMSGBM and LVMSGBP for conducting SCSI messagesignals. Contacts C8 and C9 are pins LVCDBP and LVCDBM for conductingSCSI command/data signals. Contacts D4 and D5 are pins LVANTBM andLVANTBP for conducting SCSI attention signals.

Contacts D6 and D7 are pins LVBSYBM and LVBSYBP for conducting SCSI busysignals. Contacts D8 and D9 are pins LVACKBM and LVACKBP for conductingSCSI acknowledge signals. Contact E3 is pin DIFSENB for conducting aSCSI differential sense input signal. Contacts E8 and E9 are pinsLVSCDBPHM and LVSCDBPHP for conducting SCSI high byte parity signals.Contacts G10 and G11 are pins LVSCDBPLM and LVSCDBPLP for conductingSCSI low byte parity signals. Contacts A10, A11, B10, B11, C10, C11,D10, D11, and E11 are pins for conducting system 12V power signals.Contact B1 is a pin for conducting a standby 5V power signal. Contact B2is pin 5VSBY_Pre for conducting a standby 5V precharge power signal.Contacts B3, C2, C3, and D3 are pins BLD_ID1, BLD_ID0, BLD_ID2 andBLD_ID3 for indicating an identification of the server blade. ContactsC1 and D1 are two pins for conducting system 5V power signals.

Contact D2 is a pin for conducting a system 12V precharge power signal.Contact F1 is pin CMM_CTS_M for conducting a chassis management module(CMM) flow control CTS signal. Contact G1 is pin CMM_RTS_M forconducting a CMM flow control RTS signal. Contact H1 is pin D2DATA forconducting an inter-integrated circuit (I2C) bus data signal for adisplay interface. Contact H2 is pin D2CLK for conducting an I2C busclock signal for a display interface. Contact H3 is pin BLD_B forconducting a display signal for blue color. Contact H4 is pin BLD_G forconducting a display signal for green color. Contact H5 is pin BLD_R forconducting a display signal for red color. Contact H6 is pin VSYNC forconducting a display vertical synchronous signal. Contact H7 is pinHSVNC for conducting a display horizontal synchronous signal. Contact H8is pin USB− for conducting a USB negative signal. Contact H9 is pin USB+for conducting a USB positive signal. Contact H10 is pin I2C_SCL forconducting an I2C bus clock signal. Contact H11 is pin I2C_SDA forconducting an I2C bus data signal. Contacts E10 and Y1 to Y11 is forgrounding.

FIG. 7B is a pin assignment of the second connector 622 in FIG. 6compliant with a second connector specification. The second connector622 defined in FIG. 7B can be served as the upper connector 520 of theprocessing blade module 500, as shown in FIG. 5. The second connectorspecification complies with an Upper_5G_CONN specification by Teradynewith characteristics of High-speed differential version of Very HighDensity Metric (VHDM-HSD) 8-row, 2.0 mm, female, right-angle, DIP, and92 contacts. For example, the second connector 622 compliant with thisspecification can be a connector produced by MOLEX of model number MOLEX74680-0229. The second connector 622 includes 124 contacts, such as pinsA1˜A10, B1˜B10, C1˜C10, D1˜D10, E1˜E10, F1˜F10, G1˜G10, and H1˜H10. Inparticular, the connector defined by FIG. 7B includes contacts forconducting the signal group of the management bus disclosed above.Contacts G1, H2, G2 correspond to the function selection signal,F_EN[0:2], or called local-bus function-select-enable signal. ContactsG3 to G7 correspond to the address signal, S_AD[0:4], or calledlocal-bus data signal. Contact H3 corresponds to the enabling signal,S_D0, or called local-bus data bit. Contact H4 corresponds to the strobesignal, STROBE, or called local-bus Strobe.

Contacts A1 and B1 are pins FC_GIGA_TD1N and FC_GIGA_TD1P for conductingoutput signals of a Fibre Channel/GIGA local area network (LAN)differential pair 1 complementary transmitter. Contacts A2 and B2 arepins FC_GIGA_RD1N and FC_GIGA_RD1P for conducting output signals of aFibre Channel/GIGA network differential pair 1 receiver. Contacts A3 andB3 are pins IB_RDN1_P and IB_RDP1_P for conducting input signals of anInfinite Band primary channel differential pair 1 receiver. Contacts A4and B4 are pins IB_RDN2_P and IB_RDP2_P for conducting signals ofInfinite Band primary channel differential pair 2 receiver. Contacts A5and B5 are pins IB_RDN3_P and IB_RDP3_P for conducting signals of anInfinite Band primary channel differential pair 3 receiver. Contacts A6and B6 are pins IB_RDN4_P and IB_RDP4_P for conducting signals ofInfinite Band primary channel differential pair 4 receiver. Contacts A7and B7 are pins IB_RDN1_S and IB_RDP1_S for conducting signals of anInfinite Band secondary channel differential pair 1 receiver. ContactsA8 and B8 are pins IB_RDN2_S and IB_RDP2_S for conducting signals of anInfinite Band secondary channel differential pair 2 receiver.

Contacts A9 and B9 are pins IB_RDN3_S and IB_RDP3_S for conductingsignals of an Infinite Band secondary channel differential pair 3receiver. Contacts A10 and B10 are pins IB_RDN4_S and IB_RDP4_S forconducting signals of an Infinite Band secondary channel differentialpair 4 receiver. Contacts C1 and C10 are the pins for grounding.Contacts D1 and E1 are pins FC_GIGA_TD2N, FC_GIGA_TD2P for conductingsignals of a Fibre Channel/GIGA network differential pair 2 transmitter.Contacts D2 and E2 are pins FC_GIGA_RD2N, FC_GIGA_RD2P for conductingsignals of Fibre Channel/GIGA network differential pair 2 receiver.Contacts D3 and E3 are pins IB_TDN1_P and IB_TDP1_P for conductingsignals of an Infinite Band primary channel differential pair 1transmitter. Contacts D4 and E4 are pins IB_TDN2_P and IB_TDP2_P forconducting signals of an Infinite Band primary channel differential pair2 transmitter. Contacts D5 and E5 are pins IB_TDN3_P and IB_TDP3_P forconducting signals of an Infinite Band primary channel differential pair3 transmitter. Contacts D6 and E6 are pins IB_TDN4_P and IB_TDP4_P forconducting signals of an Infinite Band primary channel differential pair4 transmitter.

Contacts D7 and E7 are pins IB_TDN1_S and IB_TDP1_S for conductingsignals of Infinite Band secondary channel differential pair 1transmitter. Contacts D8 and E8 are pins IB_TDN2_S and IB_TDP2_S forconducting signals of Infinite Band secondary channel differential pair2 transmitter. Contacts D9 and E9 are pins IB_TDN3_S and IB_TDP3_S forconducting signals of Infinite Band secondary channel differential pair3 transmitter. Contacts D10 and E10 are pins IB_TDN4_S and IB_TDP4_S forconducting signals of Infinite Band secondary channel differential pair4 transmitter. Contacts F1 and F10 are the pins for grounding. ContactG1 is pin F_EN0 for conducting a local bus function select enable0signal. Contact G2 is pin F_EN2 for conducting a local bus functionselect enable2 signal. Contacts G3 and G7 are pins S_ADOS_AD4 forconducting signals indicating local bus data bits [0:4]. Contact G8 ispin MSCLK for conducting a PS2 pointing device clock signal. Contact G9is pin KBCLK for conducting a PS2 keyboard clock signal.

Contact G10 is pin IB_GPIO for conducting a general purpose input/output(GPIO) signal for Infinite Band primary channel. Contact H1 is pin Matedfor conducting a signal for indicating whether a server blade is matedor not. Contact H2 is pin F_EN1 for conducting a local bus functionselect enable1 signal. Contact H3 is pin S_D0 for conducting a local busdata bit signal. Contact H4 for conducting a local bus strobe signal.Contact H5 is pin BLD_RX for conducting a chassis management module(CMM) receiving flow control signal. Contact H6 is pin BLD_TX forconducting a CMM transmission flow control signal. Contact H7 is pinCLEAR for conducting a local bus reset signal. Contact H8 is pin MSDATAfor conducting a PS2 pointing device clock signal. Contact H9 is pinKBDATA for conducting a PS2 keyboard clock signal; and Contact H10 ispin IB_GPIO_S for conducting a general purpose input/output (GPIO)signal for Infinite Band primary channel.

FIG. 7C is a pin assignment of the second connector 622 in FIG. 6compliant with a third connector specification. The second connector 622defined in FIG. 7C can be served as the upper connector 530 of theprocessing blade module 500, as shown in FIG. 5. The third connectorspecification complies with an Upper_Daughter specification withcharacteristics of high speed, 0.8 mm, male, double row, differentialpairs, Surface Mounted Device (SMD), and 84 contacts. For example, thesecond connector 622 compliant with this specification can be aconnector produced by Samtec of model number QTE-042-03-F-D-DP-A. Thesecond connector 622 includes 84 contacts.

The first and third contacts are pins FC_GIGA_TDN1 and FC_GIGA_TDP1 forconducting signals of a Fibre Channel/GIGA network differential pair 1transmitter. The second and fourth contacts are pins FC_GIGA_RDN1 andFC_GIGA_RDP1 for conducting signals of a Fibre Channel/GIGA networkdifferential pair 1 receiver. The fifth and seventh contacts are pinsFC_GIGA_TDN2 and FC_GIGA_TDP2 for conducting signals of an Infinite Bandprimary channel differential pair 2 transmitter. The sixth and eighthcontacts are pins FC_GIGA_RDN2 and FC_GIGA_RDP2 for conducting signalsof an Infinite Band primary channel differential pair 2 receiver. Theninth and eleventh contacts are pins IB_RDN4_P and IB_RDP4_P forconducting signals of an Infinite Band primary channel differential pair4 receiver. The tenth and twelfth contacts are pins IB_RDN4_S andIB_RDP4_S for conducting signals of an Infinite Band secondary channeldifferential pair 4 receiver. The thirteenth and fifteenth contacts arepins IB_RDN3_P and IB_RDP3_P for conducting signals of an Infinite Bandprimary channel differential pair 3 receiver. The fourteenth andsixteenth contacts are pins IB_RDN3_S and IB_RDP3_S for conductingsignals of Infinite Band secondary channel differential pair 3 receiver.

The seventeenth and nineteenth contacts are pins IB_RDN2_P and IB_RDP2_Pfor conducting signals of Infinite Band primary channel differentialpair 2 receiver. The eighteenth and twentieth contacts are pinsIB_RDN2_S and IB_RDP2_S for conducting signals of Infinite Bandsecondary channel differential pair 2 receiver. The twenty first totwenty third contacts are pins IB_RDN1_P and IB_RDP1_P for conductingsignals of Infinite Band primary channel differential pair 1 receiver.The twenty second and twenty fourth contacts are pins IB_RDN1_S andIB_RDP1_S for conducting signals of Infinite Band secondary channeldifferential pair 1 receiver. The twenty fifth and twenty seventhcontacts are pins IB_TDN4_P and IB_TDP4_P for conducting signals ofInfinite Band primary channel differential pair 4 transmitter. Thetwenty sixth and twenty eighth contacts are pins IB_TDN4_S and IB_TDP4_Sfor conducting signals of Infinite Band secondary channel differentialpair 4 transmitter. The twenty ninth and thirty first contacts are pinsIB_TDN3_P and IB_TDP3_P for conducting signals of Infinite Band primarychannel differential pair 3 transmitter. The thirtieth and thirty secondcontacts are pins IB_TDN3_S and IB_TDP3_S for conducting signals ofInfinite Band secondary channel differential pair 3 transmitter.

The thirty third and thirty fifth contacts are pins IB_TDN2_P andIB_TDP2_P for conducting signals of Infinite Band primary channeldifferential pair 2 transmitter. The thirty fourth and thirty sixthcontacts are pins IB_TDN2_S and IB_TDP2_S for conducting signals ofInfinite Band secondary channel differential pair 2 transmitter. Thethirty seventh and thirty ninth contacts are pins IB_TDN1_P andIB_TDP1_P for conducting signals of Infinite Band primary channeldifferential pair 1 transmitter. The thirty eighth and fourtiethcontacts are pins IB_TDN1_S and IB_TDP1_S for conducting signals ofInfinite Band secondary channel differential pair 1 transmitter. Theforty first contact is pin GB_LED for conducting a signal for indicatingGIGA network operation. The forty second contact is pin IB_GPIO_P forconducting a GPIO signal for Infinite Band primary channel. The fortythird contact is pin FC_LED for conducting a signal for indicating fiberchannel operation. The forty fourth contact is pin IB_GPIO_S forconducting a GPIO signal for Infinite Band secondary channel. The fortyfifth and forth seventh contacts are pins EXPB_(—)100 MHz_CLK_P andEXPB_(—)100 MHz_CLK_N for conducting clock differential pair receivingsignals for PCI Express B channel. The forty sixth contact is pinSMB4_CLK for conducting a system management bus clock signal.

The forty eight contact is pin SMB4_DTA for conducting a systemmanagement bus data signal. The forth ninth and fifty first contacts arepins EXPB_RXP0 and EXPB_RXN0 for conducting differential pair 0 receiverfor PCI Express B channel. The fifty and fifty second contacts are pinsEXPB_TXP0 and EXPB_TXN0 for conducting differential pair 0 transmitterfor PCI Express B channel. The fifty third and fifty fifth contacts arepins EXPB_RXP1 and EXPB_RXN1 for conducting differential pair 1 receiverfor PCI Express B channel. The fifty fourth and fifty sixth contacts arepins EXPB_TXP1 and EXPB_TXN1 for conducting differential pair 1transmitter for PCI Express B channel. The fifty seventh and fifty ninthcontacts are pins EXPB_RXP2 and EXPB_RXN2 for conducting differentialpair 2 receiver for PCI Express B channel. The fifty eighth and sixtiethcontacts are pins EXPB_TXP2 and EXPB_TXN2 for conducting differentialpair 2 transmitter for PCI Express B channel. The sixty first and sixtythird contacts are pins EXPB_RXP3 and EXPB_RXN3 for conductingdifferential pair 3 receiver for PCI Express B channel. The sixty secondand sixty fourth contacts are pins EXPB_TXP3 and EXPB_TXN3 forconducting differential pair 3 transmitter for PCI Express B channel.

The sixty fifth and sixty seventh contacts are pins EXPB_RXP4 andEXPB_RXN4 for conducting differential pair 4 receiver for PCI Express Bchannel. The sixty sixth and sixty eighth contacts are pins EXPB_TXP4and EXPB_TXN4 for conducting differential pair 4 transmitter for PCIExpress B channel. The sixty ninth and seventy first contacts are pinsEXPB_RXP5 and EXPB_RXN5 for conducting differential pair 5 receiver forPCI Express B channel. The seventieth and seventy second contacts arepins EXPB_TXP5 and EXPB_TXN5 for conducting differential pair 5transmitter for PCI Express B channel. The seventy third and seventyfifth contacts are pins EXPB_RXP6 and EXPB_RXN6 for conductingdifferential pair 6 receiver for PCI Express B channel. The seventyfourth and seventy sixth contacts are pins EXPB_TXP6 and EXPB_TXN6 forconducting differential pair 6 transmitter for PCI Express B channel.The seventy seventh and seventy ninth contacts are pins EXPB_RXP7 andEXPB_RXN7 for conducting differential pair 7 receiver for PCI Express Bchannel. The seventy eighth and eightieth contacts are pins EXPB_TXP7and EXPB_TXN7 for conducting differential pair 7 transmitter for PCIExpress B channel. The eighty first contact is pin SYS_PWRGD2 forconducting a system power good signal. The eighty second contact is pinWAKE_N for conducting a local area network (LAN) wake-up signal. Theeighty third and eighty fourth contacts are two pins for grounding.Contacts G1 to G12 are the pins for grounding.

FIG. 7D is a pin assignment of the second connector 622 in FIG. 6compliant with a fourth connector specification. The second connector622 defined in FIG. 7D can be served as the down connector 540 of theprocessing blade module 500, as shown in FIG. 5. The fourth connectorspecification complies with a Down_Daughter specification withcharacteristics of high speed, 0.8 mm, male, double row, SMD, and 120contacts. For example, the second connector 622 compliant with thisspecification can be a connector produced by Samtec of model numberQTE-060-03-F-D-D-A. The second connector 622 includes a first pin to a120^(th) pin, 120 contacts.

The first to ninth contacts are pins P2_AD27, P2_AD31, P2_AD26, P2_AD30,P2_AD25, P2_AD29, P2_AD24, P2_AD28 and P2_AD23 for conducting signalsfor PCI address/data. The 11^(th), 13^(th), 15^(th), 17^(th), 19^(th),21^(st), 23^(rd), 25^(th), 27^(th), and 29^(th) are pins P2_AD22,P2_AD21, P2_AD20, P2_AD19, P2_AD18, P2_AD17, P2_AD16, P2_AD15, P2_AD14and P2_AD13 for conducting signals for PCI address/data. The 31^(st),33^(rd), 35^(th), 37^(th), 39^(th), 41^(st), 43^(rd), 45^(th), 47^(th),and 49^(th) are pins P2_AD12, P2_AD11, P2_AD10, P2_AD9, P2_AD8, P2_AD7,P2_AD6, P2_AD5, P2_AD4 and P2_AD3 for conducting signals for PCIaddress/data.

The 51^(st), 53^(rd), 55^(th), 57^(th), 59^(th), 61^(st), 63^(rd),65^(th), 67^(th), and 69^(th) are pins P2_AD2, P2_AD1, P2_AD0, P2_AD63,P2_AD62, P2_AD61, P2_AD60, P2_AD59, P2_AD58 and P2_AD57 for conductingsignals for PCI address/data. The 71^(st), 73^(rd), 75^(th), 77^(th),79^(th), 81^(st), 83^(rd), 85^(th), 87^(th) and 89^(th) are pinsP2_AD56, P2_AD55, P2_AD54, P2_AD53, P2_AD52, P2_AD51, P2_AD50, P2_AD49,P2_AD48 and P2_AD47 for conducting signals for PCI address/data.

The 91^(st), 93^(rd), 95^(th), 97^(th), 99^(th), 101^(st), 103^(rd),105^(th), 107^(th), 109^(th), 111^(st), 113^(rd), 115^(th), 117^(th),and 119^(th) are pins P2_AD46, P2_AD45, P2_AD44, P2_AD43, P2_AD42,P2_AD41, P2_AD40, P2_AD39, P2_AD38, P2_AD37, P2_AD36, P2_AD35, P2_AD34,P2_AD33, and P2_AD32 for conducting signals for PCI address/data. Thecontacts G1 to G12 are pins for grounding. The 10^(th) contact is pinFC_PRESENT_N for conducting a signal for indicating fiber channelpresent. The 12^(th), 14^(th), 84^(th), and 86^(th) contacts are pinsPCIIRQ-L7, PCIIRQ-L6, PCIIRQ-L10, PCIIRQ-L9 for conducting PCI interruptsignals.

The 16^(th) contact is pin PCIX_CLK1 for conducting a PCI clock signal.The 18^(th) contact is pin PCIX_RST-L for conducting a PCI reset signal.The 20^(th) contact is pin P2_PGNT-L0 for conducting a PCI grant bus 0signal. The 22^(th) contact is pin P_REQ-L0 for conducting a PCI requestbus 0 signal. The 24^(th) contact is pin P2_PAR for conducting a PCIparity signal. The 26^(th) contact is pin P2 STOP-L for conducting a PCIstop signal. The 28^(th) contact is pin P2_DEVSEL-L for conducting a PCIdevice selection signal. The 30^(th) contact is pin P2 TRDY-L forconducting a PCI target ready signal. The 32^(nd) contact is pinP2_IRDY-L for conducting a PCI initiator ready signal. The 34^(th)contact is pin P2_FREAME-L for conducting a PCI frame signal.

The 36^(th) contact is pin P2_SERR-L for conducting a PCI system errorsignal. The 38^(th) contact is pin P2_PERR-L for conducting a PCI parityerror signal. The 40^(th) contact is pin SMBO_SCL for conducting an I2Cclock signal. The 42^(nd), 44^(th), 46^(th), and 66^(th) contacts arepins P2_CBE-L3, P2_CBE-L2, P2_CBE-L1, P2_CBE-L0, P2_CBE-L7, P2_CBE-L6,P2_CBE-L5, P2_CBE-L4 for PCI bus command and byte enable signals. The50^(th) contact is pin P2_M66EN for conducting a 66 Mhz enable signal.The 52^(th) contact is pin P2_ACK64-L for conducting a 64-bitacknowledge transfer signal.

The 54^(th) contact is pin P2_REQ64 for conducting a 64-bit requesttransfer signal. The 56^(th) contact is pin P2_PAR64 for conducting a64-bit parity check signal. The 58^(th) contact is pin SMBO_SDA forconducting an I2C data signal. The 68^(th) contact is pin PCIXCAP forconducting a PCI-X capable signal. The 70^(th) contact is pin P_REQ-L2for conducting a PCI request bus 2 signal. The 72^(th) contact is inPCIXCLK2 for conducting a PCI grant bus 2 signal. The 74^(th) contact ispin PCIX_CLK2 for conducting a PCI clock signal. The 76^(th) contact ispin IDSEL2 for conducting an initialization device selection 2 signal.The 78^(th) contact is pin IDSEL1 for conducting an initializationdevice selection 1 signal. The 80^(th) contact is pin P2_LOCK-L forconducting a PCI lock signal.

The 82^(th) contact is pin RESERVE_PME-L for conducting a PCI powermanagement event (PME) signal. The 88^(th) contact is pin SCSI_IRQB-Lfor conducting a SCSI interrupt B signal. The 90^(th) contact is pinSCSI_IRQA-L for conducting a SCSI interrupt A signal. The 92^(th)contact is pin ZCR_PRESENT-L for conducting a zero crossing (ZCR)present signal. The 94^(th) contact is pin ZCR_GNT-L for conducting aZCR grant bus signal. The 96^(th) contact is pin VCC5SBY for conductinga standby 5V power signal. The 98^(th) contact is pin VCC3 _(—)3SBY forconducting a standby 3.3V power signal. The 100^(th), 102^(nd),104^(th), and 106^(th) contacts are pins for conducting system 5V powersignals. The 108^(th) , 110^(th), 112^(nd), 114^(th), 116^(th), and118^(th) contacts are pins for conducting system 3.3V power signals. The120^(th) contact is a pin for conducting a system 12V power signal.

FIG. 7E is a pin assignment of the second connector 622 in FIG. 6compliant with a fifth connector specification. The second connector 622defined in FIG. 7E can be served as the first connector 510 of theprocessing blade module 550, as shown in FIG. 5. The fifth connectorspecification complies with a PCI_Base_Conn specification withcharacteristics of high speed, 0.8 mm, male, double row, SMD, and 40contacts. For example, the second connector 622 compliant with thisspecification can be a connector produced by Samtec of model numberQTE-020-03-F-D-A. The second connector 622 includes 40 contacts, such asa first pin to a 40^(th) pin.

The first contact is pin SERR for conducting a PCI system error signal.The second contact is pin PERR for conducting a PCI parity error signal.The fourth contact is pin SMB_CLK2 for conducting a system managementbus clock signal. The sixth contact is pin SMB_DATA2 for conducting asystem management bus data signal. The third, fifth, seventh, eighth,13^(th) to 16^(th), 22^(nd), 23^(rd), and 31^(st) to 35^(th) contactsare the pins for grounding.

The ninth to 12^(th) contacts are pins for conducting system 12V powersignals. The 17^(th) to 21^(st) contacts are pins for conducting system3.3V power signals. The 24^(th), 26^(th), 28^(th), and 30^(th) contactsare pins for conducting system 5V power signals. The 25^(th), 27^(th),and 29^(th) contacts pins for conducting system 1.5V power signals. The36^(th) and 38^(th) contacts are pins 3V3STB for standby 3.3V powersignals. The 37^(th) contact is pin PRESENT1 for conducting a PCIpresent 1 signal. The 39^(th) contact is pin PRESENT2 for conducting aPCI present 2 signal. The 40^(th) contact is pin PME for conducting aPCI power management event (PME) signal.

FIG. 2F is another pin assignment of the second connector 622 in FIG. 6compliant with the fifth connector specification. The second connector622 defined in FIG. 7F can be served as the second connector 560 of theprocessing blade module 500, as shown in FIG. 5. The fifth connectorspecification complies with a PCI_Base_Conn specification withcharacteristics of high speed, 0.8 mm, male, double row, SMD, and 40contacts. For example, the second connector 622 compliant with thisspecification can be a connector produced by Samtec of model numberQTE-020-03-F-D-A. The second connector 622 includes 40 contacts, such asa first pin to a 40^(th) pin.

The first and third contacts are pins EXPA_TX_N1 and EXPA_TX_P1 forconducting signals of differential pair 1 transmitter for PCI Expresschannel A. The second contact is pin PRESENT for conducting a PCI baseboard present signal. The fourth contact is pin PCI_RST for conducting aPCI bus reset signal. The fifth, 11^(th), 17^(th), 23^(rd), 29^(th),30^(th), 35^(th), 36^(th) contacts are pins for grounding. The sixthcontact is pin SYSTEM_PWR_OK for conducting a system power normalsignal. The seventh and ninth contacts are pins EXPA_RX_P3 andEXPA_RX_N3 for conducting signals of differential pair 3 receiver forPCI Express channel A. The eighth contact is pin SMB_CLK for conductinga system management bus clock signal. The tenth contact is pin SMB_DATAfor conducting a system management bus data signal. The twelfth contactis a pin for conducting a system 12V power signal. The 13^(th) and15^(th) contacts are pins EXPA_TX_P3 and EXPA_TX_N3 for conductingsignals of differential pair 3 transmitter for PCI Express channel A.The 14^(th) conducting system 3.3V power signals. The 19^(th) and21^(th) contacts for conducting signals are pins EXPA_RX_N2 andEXPA_RX_P2 of differential pair 2 transmitter for PCI Express channel A.The 24^(th) contact is pin 3V3STB for conducting a standby 3.3V powersignal. The 25^(th) and 27^(th) contacts are pins EXPA_TX_P0 andEXPA_TX_N0 for conducting signals of differential pair 0 transmitter forPCI Express channel A. The 26^(th) and 28^(th) contacts are pins forconducting system 1.5V power signals. The 31^(st) and 33^(rd) contactsarmme pins EXPA_RX_N0 and EXPA_RX_P0 for conducting signals ofdifferential pair 0 receiver for PCI Express channel A. The 32^(nd) and34^(th) contacts are pins EXPA_TX_N2 and EXPA_TX_P2 for conductingsignals of differential pair 2 transmitter for PCI Express channel A.The 37^(th) and 39^(th) contacts are pins EXPA_RX_N1 and EXPA_RX_P1 forconducting signals of differential pair 1 receiver for PCI Expresschannel A. The 38^(th) and 40^(th) contacts are pins EXPA_CLOCK_N andEXPA_CLOCK_P for conducting clock differential pair receiving signalsfor PCI Express channel A.

Connectors for a Management Module

Referring to FIG. 4, each of two connectors 430 and 440 of theconnection board 400 is for connection to a management module and theconnectors 430 and 440 are disposed on the rear side, for example. Theblade server system can work properly with at least one managementmodule. In the case of two management modules connecting to theconnection board 400 through the connectors 430 and 440 respectively,one of the management modules is the master and the other one is theslave. The connector 430 or 440 can be implemented by a 2.0 mm hardmetric connector of 95 pins, manufactured by FCI.

Corresponding to the blade server system 10 illustrated in FIG. 1,contacts of the connector 430 can be used to conducting signals, forexample, I2C buses signals, module present signals, management bussignals, UART bus signals, power supply unit (PSU) signals, and otherI/O signals. For the I2C buses, there are plurality of I2C buses forcommunication between the management module and each of the modules,such as processing blade modules, network switch modules, power supplyunit modules, fan modules, and KVM modules. The connectors for theremovable modules, such as processing blade modules, power supplymodules, fan modules, I/O modules, and KVM modules, in the example,include a contact for indicating the respective module present signalsfor the modules, in order to inform the management module of the presentof the modules inserted into the connection board. The connector 430thus includes contacts for receiving the module present signals. Thesemodule present signals for these modules can be transferred to themanagement module through signal paths on the connection board. Inaddition, the contacts of the connector 430 for power supply unitsignals are used for controlling the power supply units connected to theconnection board and receiving power status signals, such as power-OKsignals or early power-off signals, from the power supply units.

Contacts of the connector 430 for other I/O signals may be used toreceiving the present signal of another management module andtransmitting the present signal of the management module connected tothe connection board with the connector 430 to the another managementsignal and receiving a signal from the other management module foridentifying whether the management module with the connector 430 is themaster or slave.

In brief, the management module can receive various information from theremovable modules through the connector 430 and use the information formanagement of the blade server system. For example, the temperaturesignals measured in different sides of the connection board can also beapplied to the management module through a contact of the connector 430.The management module can determine whether to control the fan modulesaccording to the temperature signals acquired through the signal pathfor the temperature signals.

The management bus has priority over the other functional buses, such asI2C buses, and UART buses. The connectors for the respective removablemodules, such as V-KVM module, processing blade module, and networkmodules, on the connection board have contacts dedicated for conductingthe management bus signal group.

As above, a blade server system with a management bus and method formanagement thereof are disclosed by the embodiments according to theinvention. Distribution of power from a power source to the blade serversystem can be determined according to the system configurationinformation including the module configuration information with respectto the associated modules so that the power source is prevented frombeing overloaded with the blade server system. The risk of unpredictableshutdown of the blade server system due to power impact can be avoided.In addition, management functions can be performed using the managementbus, thereby achieving optimum performance.

While the invention has been described by way of example and in terms ofembodiments, it is to be understood that the invention is not limitedthereto. On the contrary, it is intended to cover various modificationsand similar arrangements and procedures, and the scope of the appendedclaims therefore should be accorded the broadest interpretation so as toencompass all such modifications and similar arrangements andprocedures.

1. A blade server system, comprising: a middle plane board including afirst connector; and a server blade including a second connector forbeing electrically connected to the first connector, the secondconnector including a plurality of contacts in compliance with aconnector specification, the contacts including: contact A1 forconducting a signal indicating whether the server blade is present;contacts A2 and A3 for conducting a SCSI (small computer systeminterface) request signal; contacts A4 to A9, B8, B9, E1, E2, E4, E7, F2to F11, G2, and G9 for conducting signals for SCSI channel byte signalpairs; contacts B4 and B5 for conducting SCSI input/output signals;contacts B6 and B7 for conducting selection signals; contacts C4 and C5for conducting SCSI reset signals; contacts C6 and C7 for conductingSCSI message signals; contacts C8 and C9 for conducting SCSIcommand/data signals; contacts D4 and D5 for conducting SCSI attentionsignals; contacts D6 and D7 for conducting SCSI busy signals; contactsD8 and D9 for conducting SCSI acknowledge signals; contact E3 forconducting a SCSI differential sense input signal; contacts E8 and E9for conducting SCSI high byte parity signals; contacts G10 and G11 forconducting SCSI low byte parity signals; contacts A10, A11, B10, B11,C10, C11, D10, D11, and E11 for conducting system 12V power signals;contact B1 for conducting a standby 5V power signal; contact B2 forconducting a standby 5V precharge power signal; contacts B3, C2, C3, andD3 for indicating an identification of the server blade; contacts C1 andD1 for conducting system 5V power signals; contact D2 for conducting asystem 12V precharge power signal; contact F1 for conducting a chassismanagement module (CMM) flow control Clear To Send (CTS) signal; contactG1 for conducting a CMM flow control Request To Send (RTS) signal;contact H1 for conducting an inter-integrated circuit (I2C) bus datasignal for a display interface; contact H2 for conducting an I2C busclock signal for a display interface; contact H3 for conducting adisplay signal for blue color; contact H4 for conducting a displaysignal for green color; contact H5 for conducting a display signal forred color; contact H6 for conducting a display vertical synchronoussignal; contact H7 for conducting a display horizontal synchronoussignal; contact H8 for conducting a Universal Serial Bus (USB) negativesignal; contact H9 for conducting a USB positive signal; contact H10 forconducting an I2C bus clock signal; contacts E10 and Y1 to Y11 forgrounding; and contact H11 for conducting a I2C bus data signal.
 2. Theblade server system according to claim 1, wherein the connectorspecification complies with a Low_EPT_CONN specification withcharacteristics of hard metric 2.0 mm, 8 single rows, 2 shielding rows,female, right-angle, Dual-Inline-Package (DIP), and 99 contacts.
 3. Ablade server system, comprising: a middle plane board for modularinterconnection, including a first connector, the first connectorincluding a plurality of contacts for conducting a management bus signalgroup for management of the blade server system; and a server bladeincluding a second connector for being electrically connected to thefirst connector, the second connector including a plurality of contactsin compliance with a connector specification, the contacts including:contacts A1 and B1 for conducting signals of a Fibre Channel/GIGAnetwork differential pair 1 transmitter; contacts A2 and B2 forconducting signals of a Fibre Channel/GIGA network differential pair 1receiver; contacts A3 and B3 for conducting signals of an InfiniBandprimary channel differential pair 1 receiver; contacts A4 and B4 forconducting signals of an InfiniBand primary channel differential pair 2receiver; contacts A5 and B5 for conducting signals of an InfiniBandprimary channel differential pair 3 receiver; contacts A6 and B6 forconducting signals of an InfiniBand primary channel differential pair 4receiver; contacts A7 and B7 for conducting signals of an InfiniBandsecondary channel differential pair 1 receiver; contacts A8 and B8 forconducting signals of an InfiniBand secondary channel differential pair2 receiver; contacts A9 and B9 for conducting signals of an InfiniBandsecondary channel differential pair 3 receiver; contacts A10 and B10 forconducting signals of an InfiniBand secondary channel differential pair4 receiver; contacts C1 and C10 for grounding; contacts D1 and E1 forconducting signals of a Fibre Channel/GIGA network differential pair 2transmitter; contacts D2 and E2 for conducting signals of a FibreChannel/GIGA network differential pair 2 receiver; contacts D3 and E3for conducting signals of an InfiniBand primary channel differentialpair 1 transmitter; contacts D4 and E4 for conducting signals of anInfiniBand primary channel differential pair 2 transmitter; contacts D5and E5 for conducting signals of an InfiniBand primary channeldifferential pair 3 transmitter; contacts D6 and E6 for conductingsignals of an InfiniBand primary channel differential pair 4transmitter; contacts D7 and E7 for conducting signals of an InfiniBandsecondary channel differential pair 1 transmitter; contacts D8 and E8for conducting signals of an InfiniBand secondary channel differentialpair 2 transmitter; contacts D9 and E9 for conducting signals of anInfiniBand secondary channel differential pair 3 transmitter; contactsD10 and E10 for conducting signals of an InfiniBand secondary channeldifferential pair 4 transmitter; contacts F1 and F10 for grounding;contact G1 for conducting a local bus function select enable0 signal;contact G2 for conducting a local bus function select enable2 signal;contacts G3 and G7 for conducting signals indicating local bus data bits[0:4]; contact G8 for conducting a PS2 pointing device clock signal;contact G9 for conducting a PS2 keyboard clock signal; contact G10 forconducting a general purpose input/output (GPIO) signal for anInfiniBand primary channel; contact H1 for conducting a signal forindicating whether a server blade is mated or not; contact H2 forconducting a local bus function select enable1 signal; contact H3 forconducting a local bus data bit signal; contact H4 for conducting alocal bus strobe signal; contact H5 for conducting a chassis managementmodule (CMM) receiving flow control signal; contact H6 for conducting aCMM transmission flow control signal; contact H7 for conducting a localbus reset signal; contact H8 for conducting a PS2 pointing device clocksignal; contact H9 for conducting a PS2 keyboard clock signal; andcontact H10 for conducting a general purpose input/output(GPIO) signalfor an InfiniBand primary channel, wherein the management bus signalgroup includes the local bus function select enable0 signal, the localbus function select enable1 signal, the local bus function selectenable2 signal, the signals indicating local bus data bits [0:4], thelocal bus data bit signal, and the local bus strobe signal.
 4. The bladeserver system according to claim 3, the connector specification complieswith an Upper_(—)5G_CONN specification with characteristics ofHigh-speed differential version of Very High Density Metric (VHDM-HSD) 8row, 2.0 mm, female, right-angle, Dual-Inline-Package(DIP), and 92contacts.
 5. A blade server system, comprising: a middle plane boardincluding a first connector; and a server blade including a secondconnector for being electrically connected to the first connector, thesecond connector including a plurality of contacts in compliance with aconnector specification, the contacts including: first and thirdcontacts for conducting signals of a Fibre Channel/GIGA networkdifferential pair 1 transmitter; second and fourth contacts forconducting signals of a Fibre Channel/GIGA network differential pair 1receiver; fifth and seventh contacts for conducting signals of anInfiniBand primary channel differential pair 2 transmitter; sixth andeighth contacts for conducting signals of an InfiniBand primary channeldifferential pair 2 receiver; ninth and eleventh contacts for conductingsignals of InfiniBand primary channel differential pair 4 receiver;tenth and twelfth contacts for conducting signals of an InfiniBandsecondary channel differential pair 4 receiver; thirteenth and fifteenthcontacts for conducting signals of an InfiniBand primary channeldifferential pair 3 receiver; fourteenth and sixteenth contacts forconducting signals of an InfiniBand secondary channel differential pair3 receiver; seventeenth and nineteenth contacts for conducting signalsof an InfiniBand primary channel differential pair 2 receiver;eighteenth and twentieth contacts for conducting signals of anInfiniBand secondary channel differential pair 2 receiver; twenty-firstand twenty-third contacts for conducting signals of an InfiniBandprimary channel differential pair 1 receiver; twenty-second andtwenty-fourth contacts for conducting signals of an InfiniBand secondarychannel differential pair 1 receiver; twenty-fifth and twenty-seventhcontacts for conducting signals of an InfiniBand primary channeldifferential pair 4 transmitter; twenty-sixth and twenty-eighth contactsfor conducting signals of an InfiniBand secondary channel differentialpair 4 transmitter; twenty-ninth and thirty-first contacts forconducting signals of an InfiniBand primary channel differential pair 3transmitter; thirtieth and thirty-second contacts for conducting signalsof an InfiniBand secondary channel differential pair 3 transmitter;thirty-third and thirty-fifth contacts for conducting signals of anInfiniBand primary channel differential pair 2 transmitter;thirty-fourth and thirty-sixth contacts for conducting signals of anInfiniBand secondary channel differential pair 2 transmitter;thirty-seventh and thirty-ninth contacts for conducting signals of anInfiniBand primary channel differential pair 1 transmitter;thirty-eighth and fortieth contacts for conducting signals of anInfiniBand secondary channel differential pair 1 transmitter; aforty-first contact for conducting a signal for indicating GIGA networkoperation; a forty-second contact for conducting a General Purpose InputOutput (GPIO) signal for an InfiniBand primary channel; a forty-thirdcontact for conducting a signal for indicating fiber channel operation;a forty-fourth contact for conducting a GPIO signal for an InfiniBandsecondary channel; forty-fifth and forty-seventh contacts for conductingclock differential pair receiving signals for a Perpheral ComponentInterconnect (PCI) Express B channel; a forty-sixth contact forconducting a system management bus clock signal; a forty-eight contactfor conducting a system management bus data signal; forty-ninth andfifty-first contacts for conducting signals of a differential pair 0receiver for PCI Express B channel; fifty and fifty-second contacts forconducting signals of a differential pair 0 transmitter for PCI ExpressB channel; fifty-third and fifty-fifth contacts for conducting signalsof a differential pair 1 receiver for PCI Express B channel;fifty-fourth and fifty-sixth contacts for conducting signals of adifferential pair 1 transmitter for PCI Express B channel; fifty-seventhand fifty-ninth contacts for conducting signals of a differential pair 2receiver for PCI Express B channel; fifty-eighth and sixtieth contactsfor conducting signals of a differential pair 2 transmitter for PCIExpress B channel; sixty-first and sixty-third contacts for conductingsignals of a differential pair 3 receiver for PCI Express B channel;sixty-second and sixty-fourth contacts for conducting signals of adifferential pair 3 transmitter for PCI Express B channel; sixty-fifthand sixty-seventh contacts for conducting signals of a differential pair4 receiver for PCI Express B channel; sixty-sixth and sixty-eighthcontacts for conducting signals of a differential pair 4 transmitter forPCI Express B channel; sixty-ninth and seventy-first contacts forconducting signals of a differential pair 5 receiver for PCI Express Bchannel; seventieth and seventy second contacts for conducting signalsof a differential pair 5 transmitter for PCI Express B channel;seventy-third and seventy-fifth contacts for conducting signals of adifferential pair 6 receiver for PCI Express B channel; seventy-fourthand seventy-sixth contacts for conducting signals of a differential pair6 transmitter for PCI Express B channel; seventy-seventh andseventy-ninth contacts for conducting signals of a differential pair 7receiver for PCI Express B channel; seventy-eighth and eightiethcontacts for conducting signals of a differential pair 7 transmitter forPCI Express B channel; an eighty-first contact for conducting a systempower good signal; an eighty-second contact for conducting a local areanetwork (LAN) wake-up signal; eighty-third and eighty fourth contactsfor grounding; and contacts G1 to G12 for grounding.
 6. The blade serversystem according to claim 5, wherein the connector specificationcomplies with an Upper_Daughter specification with characteristics ofhigh speed, 0.8 mm, male, double row, differential pairs,Surface MountedDevice (SMD), and 84 contacts.
 7. A blade server system, comprising: amiddle plane board including a first connector; and a server bladeincluding a second connector for being electrically connected to thefirst connector, the second connector including a plurality of contactsin compliance with a connector specification, the contacts including:first to ninth, 11^(th), 13^(th), 15^(th), 17^(th), 19^(th), 21^(st),23^(rd), 25^(th), 27^(th), 29^(th), 31^(st), 33^(rd), 35^(th), 37^(th),39^(th), 41^(st), 43^(rd), 45^(th), 47^(th), 49^(th), 51^(st), 53^(rd),55^(th), 57^(th), 59^(th), 61^(st), 63^(rd), 65^(th), 67^(th), 69^(th),71^(st), 73^(rd), 75^(th), 77^(th), 79^(th), 81^(st), 83^(rd), 85^(th),87^(st), 89^(th), 91^(st), 93^(rd), 95^(th), 97^(th), 99^(th), 101^(st),103^(rd), 105^(th), 107^(th), 109^(th), 111^(th), 113^(th), 115^(th),117^(th), and 119^(th) contacts for conducting signals for PeripheralComponent Interconnect (PCI) address/data; contacts G1 to G12 forgrounding; a 10^(th) contact for conducting a signal for indicatingfiber channel present; 12^(th), 14^(th), 84^(th), and 86 contacts forconducting PCI interrupt signals; a 16^(th) contact for conducting a PCIclock signal; an 18^(th) contact for conducting a PCI reset signal; a20^(th) contact for conducting a PCI grant bus 0 signal; a 22^(nd)contact for conducting a PCI request bus 0 signal; a 24^(th) contact forconducting a PCI parity signal; a 26^(th) contact for conducting a PCIstop signal; a 28^(th) contact for conducting a PCI device selectionsignal; a 30^(th) contact for conducting a PCI target ready signal; a32^(nd) contact for conducting a PCI initiator ready signal; a 34^(th)contact for conducting a PCI frame signal; a 36^(th) contact forconducting a PCI system error signal; a 38^(th) contact for conducting aPCI parity error signal; a 40^(th) contact for conducting an I2C clocksignal; 42^(nd), 44^(th), 46^(th), and 66^(th) contacts for PCI buscommand and byte enable signals; a 50^(th) contact for conducting a 66Mhz enable signal; a 52^(nd) contact for conducting a 64-bit acknowledgetransfer signal; a 54^(th) contact for conducting a 64-bit requesttransfer signal; a 56^(th) contact for conducting a 64-bit parity checksignal; a 58^(th) contact for conducting a I2C data signal; a 68^(th)contact for conducting a PCI-X capable signal; a 70^(th) contact forconducting a PCI request bus 2 signal; a 72^(nd) contact for conductinga PCI grant bus 2 signal; a 74^(th) contact for conducting a PCI clocksignal; a 76^(th) contact for conducting an initialization deviceselection 2 signal; a 78^(th) contact for conducting an initializationdevice selection 1 signal; an 80^(th) contact for conducting a PCI locksignal; an 82^(nd) contact for conducting a PCI power management event(PME) signal; an 88^(th) contact for conducting a Small Computer SystemInterface (SCSI) interrupt B signal; a 90^(th) contact for conducting aSCSI interrupt A signal; a 92^(nd) contact for conducting a zerocrossing (ZCR) present signal; a 94^(th) contact for conducting a ZCRgrant bus signal; a 96^(th) contact for conducting a standby 5V powersignal; a 98^(th) contact for conducting a standby 3.3V power signal;100^(th), 102^(nd), 104^(th), and 106^(th) contacts for conductingsystem 5V power signals; 108^(th), 110^(th), 112^(th), 114^(th),116^(th), and 118^(th) contacts for conducting system 3.3V powersignals; and a 120^(th) contact for conducting a system 12V powersignal.
 8. The blade server system according to claim 7, wherein theconnector specification complies with a Down_Daughter specification withcharacteristics of high speed, 0.8 mm, male, double row, SMD, and 120contacts.
 9. A blade server system, comprising: a middle plane boardincluding a first connector; and a server blade including a secondconnector for being electrically connected to the first connector, thesecond connector including a plurality of contacts in compliance with aconnector specification, the contacts including: a first contact forconducting a PCI system error signal; a second contact for conducting aPCI parity error signal; a fourth contact for conducting a systemmanagement bus clock signal; a sixth contact for conducting a systemmanagement bus data signal; third, fifth, seventh, eighth, 13^(th) to16^(th), 22^(nd), 23^(rd), and 31^(st) to35^(th) contacts for grounding;ninth to 12^(th) contacts for conducting system 12V power signals;17^(th) to 21^(st) contacts for conducting system 3.3V power signals;24^(th), 26^(th), 28^(th), and 30^(th) contacts for conducting system 5Vpower signals; 25^(th), 27^(th), and 29^(th) contacts for conductingsystem 1.5V power signals; 36^(th) and 38^(th) contacts for conductingstandby 3.3V power signals; a 37^(th) contact for conducting a PCIpresent 1 signal; a 39^(th) contact for conducting a PCI present 2signal; and a 40^(th) contact for conducting a PCI power managementevent (PME) signal.
 10. The blade server system according to claim 9,wherein the connector specification complies with a PCI_Base_Connspecification with characteristics of high speed, 0.8 mm, male, doublerow, SMD, and 40 contacts.
 11. A blade server system, comprising: amiddle plane board including a first connector; and a server bladeincluding a second connector for being electrically connected to thefirst connector, the second connector including a plurality of contactsin compliance with a connector specification, the contacts including:first and third contacts for conducting signals of differential pair 1transmitter for PCI Express channel A; a second contact for conducting aPCI base board present signal; a fourth contact for conducting a PCI busreset signal; fifth, 11^(th), 17^(th), 23^(rd), 29^(th), 30^(th),35^(th), 36^(th) contacts for grounding; a sixth contact for conductinga system power normal signal; seventh and ninth contacts for conductingsignals of a differential pair 3 receiver for PCI Express channel A; aneighth contact for conducting a system management bus clock signal; atenth contact for conducting a system management bus data signal; atwelfth contact for conducting a system 12V power signal; 13^(th) and15^(th) contacts for conducting signals of a differential pair 3transmitter for PCI Express channel A; a 14^(th) contact for conductinga system 5V power signal; 16^(th), 18^(th), 20^(th), and 22^(nd)contacts for conducting system 3.3V power signals; 19^(th) and 21^(st)contacts for conducting signals of a differential pair 2 transmitter forPCI Express channel A; a 24^(th) contact for conducting a standby 3.3Vpower signal; 25^(th) and 27^(th) contacts for conducting signals of adifferential pair 0 transmitter for PCI Express channel A; 26^(th) and28^(th) contacts for conducting system 1.5V power signals; 31^(st) and33^(rd) contacts for conducting signals of a differential pair 0receiver for PCI Express channel A; 32^(nd) and 34^(th) contacts forconducting signals of a differential pair 2 transmitter for PCI Expresschannel A; 37^(th) and 39^(th) contacts for conducting signals of adifferential pair 1 receiver for PCI Express channel A; and 38^(th) and40^(th) contacts for conducting clock differential pair receivingsignals for PCI Express channel A.
 12. The blade server system accordingto claim 11, the connector specification complies with a PCI_Base_Connspecification with characteristics of high speed, 0.8 mm, male, doublerow, SMD, and 40 contacts.